PCB Boards
HDI Board
Laser microvias + ELIC, 75μm traces/gaps. 5G, ADAS, smartphones.
Features
Laser Microvias Ø0.1mm
ELIC
75μm Traces/Gaps
ENIG
Impedance ±5%
Technical Specifications
| Layers | 6-12 |
| Microvias | Ø0.1mm |
| Traces/Gaps | 75μm |
| Min. BGA Pitch | 0.35mm |
| Finish | ENIG |
| Lead Time | 5-7 days |